The Journal of China Universities of Posts and Telecommunications ›› 2021, Vol. 28 ›› Issue (2): 1-13.doi: 10.19682/j.cnki.1005-8885.2021.1001

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Repair the faulty TSVs with the improved FNS-CAC codec 

Wei Chen, Cui Xiaole, Cui Xiaoxin, Feng Xu, Jin Yufeng   

  1. 1. Key Laboratory of Integrated Microsystems, Peking University Shenzhen Graduate School, Shenzhen 518055, China
    2. Institute of Microelectronics, Peking University, Beijing 100871, China
    3. Artificial Intelligence Research Center, Peng Cheng Laboratory, Shenzhen 518055, China

  • Received:2020-08-25 Revised:2021-03-16 Online:2021-04-30 Published:2021-04-30
  • Contact: Cui Xiaole

Abstract: Through-silicon via (TSV) is a key enabling technology for the emerging 3-dimension (3D) integrated circuits
(ICs). However, the crosstalk between the neighboring TSVs is one of the important sources of the soft faults. To
suppress the crosstalk, the Fibonacci-numeral-system-based crosstalk avoidance code ( FNS-CAC) is an effective
scheme. Meanwhile, the self-repair schemes are often used to deal with the hard faults, but the repaired results
may change the mapping between signals to TSVs, thus may reduce the crosstalk suppression ability of FNS-CAC.
A TSV self-repair technique with an improved FNS-CAC codec is proposed in this work. The codec is designed
based on the improved Fibonacci numeral system (FNS) adders, which are adaptive to the health states of TSVs.
The proposed self-repair technique is able to suppress the crosstalk and repair the faulty TSVs simultaneously. The
simulation and analysis results show that the proposed scheme keeps the crosstalk suppression ability of the original
FNS-CAC, and it has higher reparability than the local self-repair schemes, such as the signal-switching-based and
the signal-shifting-based counterparts.

Key words: through-silicon via (TSV), build-in self-repair (BISR), crosstalk avoidance code (CAC), Fibonacci number 

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