Fair e-payment protocol based on blind signature

doi:10.1016/S1005-8885(08)60277-0

Acta Metallurgica Sinica(English letters) ›› 2009, Vol. 16 ›› Issue (5): 114-118.doi: 10.1016/S1005-8885(08)60277-0

Fair e-payment protocol based on blind signature

王建辉,LIU Jing-wei, LI Xiao-hui, KOU Wei-dong

.State Key Lab of ISN, Xidian University, Xi’an 710071, China

收稿日期:2009-04-13 修回日期:1900-01-01 出版日期:2009-10-30
通讯作者: 王建辉

Fair e-payment protocol based on blind signature

WANG Jian-hui, LIU Jing-wei, LI Xiao-hui, KOU Wei-dong

.State Key Lab of ISN, Xidian University, Xi’an 710071, China

Received:2009-04-13 Revised:1900-01-01 Online:2009-10-30
Contact: WANG Jian-hui

摘要/Abstract

摘要：

Electronic transaction through e-payment protocol will grow tremendous in the coming years. In this article, by conversely using blind signature, the authors propose a fair electronic payment scheme for electronic commerce, which can ensure two participants’ right simultaneously in electronic transaction process. This scheme is different from other existing schemes and it does not require strong trust relation between customer and merchant. In the scheme, a semi-trusted third party (S-TTP) is involved to provide a fair commerce environment. The S-TTP takes part in the protocol on-line and no secure information about the business is leaked. Moreover, the participants do not need to register to S-TTP. This scheme does not require intervention of a third party in case of dispute, if one user cheats or simply crashes.

关键词:

electronic;business,;e-payment,;fairness,;S-TTP,;blind;signature

Abstract:

Key words:

electronic business;e-payment;fairness;S-TTP;blind signature

WANG Jian-hui, LIU Jing-wei, LI Xiao-hui, KOU Wei-dong. Fair e-payment protocol based on blind signature[J]. Acta Metallurgica Sinica(English letters), 2009, 16(5): 114-118.

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Fair e-payment protocol based on blind signature

Fair e-payment protocol based on blind signature

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