1. Paul C R. Analysis of multiconductor transmission lines. 2nd ed. New York, NY, USA: Wiley, 2007
2. Papazyan R, Petterson P, Edin H, et al. Extraction of high frequency power cable characteristics from S-parameter measurements. IEEE Transaction on Dielectrics and Insulation, 2004, 11(3): 461–470
3. Chen G, Zhu L, Melde K L. Extraction of frequency dependent RLCG parameters of the packaging interconnects on low-loss substrates from frequency domain measurements. Proceedings of the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, Oct 24-26, 2005,Austin, TX, USA. Piscataway, NJ, USA: IEEE, 2005: 25–28
4. Eisenstadt W R, Eo Y. S-parameters-based IC interconnect transmission line characterization. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992, 15(4): 483–490
5. Zhang J J, Hsiang T Y. Extraction of subterahertz transmission-line parameters of coplanar waveguides. Piers Online, 2007, 3(7): 1102–1106
6. Degerstrom M J, Gilbert B K, Daniel E S. Accurate resistance, inductance, capacitance, and conductance (RLCG) from uniform transmission line measurements. Proceedings of the 2008 IEEE Electrical Performance of Electronic Packaging, Oct 27-29, 2008, San Jose, CA, USA. Piscataway, NJ, USA: IEEE, 2008: 77–80
7. Chen Z Q, Chun S J. Per-unit-length RLGC extraction using a lumped port de-embedding method for application on periodically loaded transmission lines. Proceedings of the 56th Electronic Components and Technology Conference, May 30-Jun 2, 2006, San Diego, CA, USA. Piscataway, NJ, USA: IEEE, 2006: 1770–1775
8. Cortes-Hernandez D M, Sanchez-Mesa J, Galvez-Sahagun B, et al. Characterizing printed transmission lines from calculated frequency-dependent resistance and inductance and experimental propagation constant. Proceedings of the 2006 IEEE MTT-S Latin America Microwave Conference (LAMC’16), Dec 12-14, 2016, Puerto Vallarta, Mexico. Piscataway, NJ, USA: IEEE, 2017: 4p
9. Kim W P, Kim J H, Oh D, et al. S-parameters based transmission line modeling with accurate low-frequency response. Proceedings of the 2006 IEEE Electrical Performane of Electronic Packaging 2007: 79–82, Oct 23-5, 2006, Scottsdale, AZ, USA. Piscataway, NJ, USA: IEEE,
10. Sampath M K. On addressing the practical issues in the extraction of RLGC parameters for lossy multiconductor transmissin lines using S-parameters models. Proceedings of the 2008 IEEE Electrical Performance of Electronic Packaging, Oct 27-29, 2008, San Jose, CA, USA. Piscataway, NJ, USA: IEEE, 2008: 259–262
11. Zhang J M, Drewniak J L, Pommerenke D J, et al. Causal RLGC(f) models for transmission lines from measured S-parameters. IEEE Transactions on Electromagnetic Compatibility, 2010, 52(1): 189–198
12. Chu Y H,Yu Z W, Qian Z G. Robust and efficient RLGC extraction for transmission line structures with periodic three-dimensional geometries. Proceedings of the 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, Mar 15-21, 2015, Santa Clara, CA, USA. Piscataway, NJ, USA: IEEE, 2015: 203–208
13. Hasirci Z, Cavdar I H, Ozturk M. Applicability comparison of transmission line parameter extraction methods for busbar distribution systems. Journal of Electrical Engineering and Technology, 2017, 12(2): 586–593
14. Yang L, Lu G Z. Study on distributed capacitances of multi-conductor transmission lines in dielectric layers. Proceedings of the 2016 IEEE International Conference on Electronic Information and Communication Technology ( ICEICT'16) 2017: 489–492, Aug 20-22, 2016, Harbin, China. Piscataway, NJ, USA: IEEE,
Lu G Z, Guo X Q, Zeng D D. Proximity effect and distribution parameters of multi-conductor transmission lines. Chinese Journal of Radio Science, 2016, 31(3): 611–622 (in Chinese) |