| 1. Ciamulski T, Gwarek W K. Extended concept of crosstalk elimination in multiconductor transmission lines. Asia-Pacific Microwave Conference Proceedings (APMC’05): Vol 5, Dec 4-7, 2005, Suzhou, China. Piscataway, NJ, USA: IEEE, 2005: 4p
2. Plumb R G, Harrington R F, Adams A T. An electromagnetic model for multiconductor connectors. IEEE Transactions on Electromagnetic Compatibility, 1990, 32(1): 38-52
3. Broyde F, Clavelier E. A new method for the reduction of crosstalk and echo in multiconductor interconnections. IEEE Transactions on Circuits and Systems-I: Regular Papers, 2005, 52(2): 405-416
4. Yordanov H, Ivrlac M, Nossek J, et al. Field modelling of a multiconductor digital bus. Proceedings of the 37th European Microwave Integrated Circuit Conference (EUMIC’07), Oct 8-10, 2007, Munich, Germany. Piscataway, NJ, USA: IEEE, 2007: 1377-1380
5. Paul C R, Bowles B A. Symbolic solution of the multiconductor transmission-line equations for lines containing shielded wires. IEEE Transactions on Electromagnetic Compatibility, 1991, 33(3): 149-162
6. Paul C R, Bowles B A. Literal solution of the transmission-line equations for shielded wires. Proceedings of the 1990 IEEE International Symposium on Electromagnetic Compatibility, Aug 21-23, 1990, Washington DC, USA. Piscataway, NJ, USA: IEEE, 1990: 591-599
7. Paul C R. Efficient numerical computation of the frequency response of cables illuminated by an electromagnetic field. IEEE Transactions on Microwave Theory and Techniques, 1974, 22(4): 454-457
8. Savage J S, Smith W T, Paul C R. Moment method calculation of the per-unit-length parameters of cable bundles. Proceedings of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Aug 22-26, 1994, Chicago, IL, USA. Piscataway, NJ, USA: IEEE, 1994: 441-446
9. Paul C R, Feather A E. Computation of the transmission line inductance and capacitance matrices from the generalized capacitance matrix. IEEE Transactions on Electromagnetic Compatibility, 1976, 18(4): 175-183
10. Liu Y W, Kang L, Mei K K. Capacitance extraction for electrostatic multiconductor problems by on-surface MEI. IEEE Transactions on Advanced Packaging, 2000, 23(3): 489-494
11. Nabors K, White J. A fast multipole algorithm for capacitance extraction of complex 3-D geometries. Proceedings of the IEEE 1989 Custom Integrated Circuits Conference, May 15-18, 1989, San Diego, CA, USA. Piscataway, NJ, USA: IEEE, 1989: 21.7/1-21.7/4
12. Giri D V, Tesche F M, Chang S K. The transverse distribution of surface charge densities on multiconductor transmission lines. IEEE Transactions on Electromagnetic Compatibility, 1979, 21(3): 220-227 |
