Scope and Motivation

Integrated circuit (IC) is one of the great achievements of humanity, concentrating various complex functions on tiny chips as the core brain of intelligence, supporting tens of thousands of applications and services in human society. As the cornerstone of the modern information society, its strategic role is increasingly evident at the national level, especially in recent years when China has been blocked by foreign countries. The IC industry is a typical cross disciplinary field that includes both digital and analog chip design, as well as top-down EDA tool chain support, as well as physical processes and manufacturing related packaging testing. In addition, the development of IC has also leveraged huge downstream application industries, such as communication, automotive, electronics, etc. This is a complex system, and the fact that  IC technology in China is relatively backward requires urgent strengthening of research on various IC technologies. Therefore, we will solicit excellent papers from experts and scholars engaged in IC research in the fields of circuit and system design, EDA automation, process materials, communication applications, and other related research fields, conduct discussions and exchanges, and share the latest research results of IC.

Topics

Therefore, in this special issue, we propose the theme of IC research, which aims to attract the research of chip design, EDA tools, process materials, and related applications, etc. The content of IC includes but is not limited to the following topics:

●  IC and System Design

●  Digital, analog, mixed signal IC and SoC technology

●  Chiplet design and package

●   Agile development for CPU and memory

●   EDA tool and CAD

●  Digital EDA: synthesis, physical layout, placement & routing, timing/power analysis

●  Analog EDA: layout synthesis, spice simulation, DRC and STD cell library

●  Verification: formal verification, testing, package, thermal simulation for 3D chip

●  Semiconductor devices, processes, and microsystems

●  Wireless system equipment, low power, RF equipment, organic semiconductor devices, compound semiconductor devices, etc

●  Silicon IC process and manufacturing, carbon based IC technology and 3D chip development

●  Terahertz and microwave microsystems, sensor technology

●  Applications and others

●  Communication technology and specialized circuit systems

●  DFT (design-for-test) for communication

●   Reliability of chips, circuits, and systems

The author is welcome to submit his high-quality and original research results to the theme of “Integrated Circuit”. All contributions are subject to anonymous peer review.

Please submit your contributions online through the contribution system of Journal of China University of Posts and Telecommunications, and select the“Special Issue on Integrated Circuit” as the type of contribution, otherwise, the contribution will be considered as an ordinary contribution. Please log in to the official website of the journal for submission procedures https://jcupt.bupt.edu.cn. Check the submission instructions and submit according to the submission guidelines.

Important Dates

Submission Deadline: November 30, 2023

Acknowledgement and comments:  December 30, 2023

Final Decision: January 15, 2024

Final Manuscript Submission: January 25, 2024

Publication Date: April 30, 2024

Team

Deputy Editor-in-Chief

Zhang Jie (张杰), Beijing University of Posts and Telecommunications, China

Guest Editors