Behavior modeling on the PIM performance in connectors using FEA method and circuit simulation

doi:10.19682/j.cnki.1005-8885.2021.0007

中国邮电高校学报(英文) ›› 2021, Vol. 28 ›› Issue (1): 87-93.doi: 10.19682/j.cnki.1005-8885.2021.0007

Behavior modeling on the PIM performance in connectors using FEA method and circuit simulation

敦书波¹,金秋延²,毕凌宇³,王紫任³,谢军¹

1. 中国电子科技集团公司第五十四研究所
2. 西南交通大学
3. 北京邮电大学

收稿日期:2020-07-03 修回日期:2020-12-10 出版日期:2021-02-28 发布日期:2021-03-28
通讯作者: 金秋延 E-mail:jinqiuyan2010@sina.com
基金资助:
This work was supported by the National Natural Science Foundation of China (62090012,62031016, 61831017), and the Sichuan Provincial Science and Technology Important Projects ( 2019YFG0498, 2020YFG0282, 2020YFG0452 and 2020YFG0028).

Behavior modeling on the PIM performance in connectors using FEA method and circuit simulation

1. The 54th Research Institute of CETC, Shijiazhuang 050050, China 2. School of Information Science and Technology, Southwest Jiaotong University, Chengdu 614202, China 3. School of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China

Received:2020-07-03 Revised:2020-12-10 Online:2021-02-28 Published:2021-03-28
Supported by:
This work was supported by the National Natural Science Foundation of China (62090012,62031016, 61831017), and the Sichuan Provincial Science and Technology Important Projects ( 2019YFG0498, 2020YFG0282, 2020YFG0452 and 2020YFG0028).

摘要/Abstract

摘要：

Coaxial connectors are generally regarded as a kind of potential passive non-linear source when magnetic materials are applied in the coating or under-plating, which may result in serious passive intermodulation (PIM) interference and degrade the communication quality. In this paper, the effect of connector coating materials on the PIM is theoretically studied using finite element analysis (FEA) and circuit simulations. Considering the material composition both in central and outer conductor, an FEA model of connector is proposed to identify the current density in magnetic material region. An equivalent circuit model expressing the nonlinearity in coating material is developed, coupled with the non-linear transfer model. The PIM product power of the connector with related material configuration is predicted by harmonic balance simulation. Intentionally design connector samples are used in PIM tests and the measurement results are consistent with the theoretical predictions. The PIM performance in coaxial connectors is demonstrated from the perspectives of both modeling analysis and experimental investigations.

关键词:

passive intermodulation(PIM)|finite element analysis(FEA)|circuit model|coaxial connector

Abstract:

interference and degrade the communication quality. In this paper, the effect of connector coating materials on the PIM is theoretically studied using finite element analysis (FEA) and circuit simulations. Considering the material composition both in central and outer conductor, an FEA model of connector is proposed to identify the current density in magnetic material region. An equivalent circuit model expressing the nonlinearity in coating material is developed, coupled with the non-linear transfer model. The PIM product power of the connector with related material configuration is predicted by harmonic balance simulation. Intentionally design connector samples are used in PIM tests and the measurement results are consistent with the theoretical predictions. The PIM performance in coaxial connectors is demonstrated from the perspectives of both modeling analysis and experimental investigations.

Key words: passive intermodulation(PIM)|finite element analysis(FEA)|circuit model|coaxial connector

Dun Shubo, Jin Qiuyan, Bi Lingyu, Wang Ziren, Xie Jun. Behavior modeling on the PIM performance in connectors using FEA method and circuit simulation [J]. The Journal of China Universities of Posts and Telecommunications, 2021, 28(1): 87-93.

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Behavior modeling on the PIM performance in connectors using FEA method and circuit simulation

Behavior modeling on the PIM performance in connectors using FEA method and circuit simulation

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